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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/28 tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 www.rohm.com serial eeprom series automotive eeprom 105 operation spi bus eeprom br25a256-3m general description br25a256-3m is a 256kbit serial eeprom of spi bus interface. features ? high speed clock action up to 10mhz (max.) ? wait function by holdb terminal ? part or whole of memory arrays settable as read only memory area by program ? 2.5v to 5.5v single power source action most suitable. ? up to 64byte in page write mode. ? for spi bus interface (cpol, cpha) = (0, 0), (1, 1) ? auto erase and auto end function at data rewrite ? low current consumption ? at write action (5v) : 1.0ma (typ.) ? at read action (5v) : 2.0ma (typ.) ? at standby action (5v) : 0.1a (typ.) ? address auto increment function at read action ? write mistake prevention function ? write prohibition at power on ? write prohibition by command code (wrdi) ? write prohibition by wp pin ? write prohibition block setting by status registers (bp1, bp0) ? write mistake prevention function at low voltage ? more than 100 years data retention. ? more than 1 million write cycles. ? bit format 32k 8 ? initial delivery data memory array: ffh status register: wpen, bp1, bp0 : 0 ? aec-q100 qualified. packages w(typ.) x d(typ.) x h(max.) tssop-b8 3.00mm x 6.40mm x 1.20mm sop8 5.00mm x 6.20mm x 1.71mm sop- j8 4.90mm x 6.00mm x 1.65mm figure 1.
datasheet 2/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com absolute maximum ratings (ta=25c) parameter symbol ratings unit remarks supply voltage v cc -0.3 to +6.5 v power dissipation. pd 0.45(sop8) w when using at ta=25c or higher 4.5mw to be reduced per 1c. 0.45 (sop-j8) when using at ta=25c or higher 4.5mw to be reduced per 1c. 0.33 (tssop-b8) when using at ta=25c or higher 3.3mw to be reduced per 1c. storage temperature tstg - 65 to +150 c operating temperature topr - 40 to +105 c terminal voltage \ - 0.3 to vcc+1.0 v the max value of terminal voltage is not over 6.5v. when the pulse width is 50ns or less, the min value of terminal voltage is not under -1.0v. junction temperature tjmax 150 c junction temperature at the storage condition caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. memory cell characteristics (vcc=2.5v to 5.5v) parameter limits unit condition min typ max number of data rewrite times (note1) 1,000,000 - - times ta 25c 150,000 - - times ta 105c data hold years (note1) 100 - - years ta 25c 20 - - years ta 105c (note1) not 100% tested recommended operating ratings parameter symbol ratings unit power source voltage vcc 2.5 to 5.5 v input voltage v in 0 to vcc input / output capacity (ta=25c, frequency=5mhz) parameter symbol min max unit conditions input capacity (note1) c in 8 pf v in =gnd output capacity (note1) c out 8 v out =gnd (note1) not 100% tested. electrical characteristics (unless otherwise specified, ta=-40c to +105c, vcc=2.5v to 5.5v) parameter symbol limits unit conditions min typ max ?h? input voltage v ih 0.7xvcc vcc+1.0 v ?l? input voltage v il -0.3 (note1) 0.3xvcc v ?l? output voltage v ol 0 0.4 v i ol =3.0ma ?h? output voltage v oh vcc-0.2 vcc v i oh =-2.0ma input leakage current i li - 1 1 a v in =0 to vcc output leakage current i lo - 1 1 a v out =0 to vcc, csb=vcc operating current write i cc1 3 ma vcc=5.5v, f sck =10mhz, t e/w =5ms byte write, page write, write status register operating current read i cc2 4 ma vcc=5.5v, f sck =10mhz, so=open read, read status register standby current isb 10 a vcc=5.5v, so=open csb=holdb=wpb=vcc, sck=si=vcc or gnd (note1) when the pulse width is 50ns or less, it is -1.0v.
datasheet 3/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com operating timing characteristics (ta=-40c to +105c, 2.5v vcc<4.0v c l =30pf, 4.0v vcc 5.5v c l =50pf) parameter symbol 2.5 ? vcc? 5.5v unit . min typ max sck frequency f sck 0.01 - 10 - sck high time t sckwh 40 - - ns sck low time t sckwl 40 - - ns csb high time t cs 40 - - ns csb setup time t css 30 - - ns csb hold time t csh 30 - - ns sck setup time t scks 20 - - ns sck hold time t sckh 20 - - ns si setup time t dis 10 - - ns si hold time t dih 10 - - ns data output delay time t pd - - 40 ns output hold time t oh 0- - ns output disable time t oz - - 40 ns holdb setting setup time t hfs 0- - ns holdb setting hold time t hfh 10 - - ns holdb release setup time t hrs 0- - ns holdb release hold time t hrh 10 - - ns time from holdb to output high-z t hoz - - 40 ns time from holdb to output change t hpd - - 40 ns sck rise time ( n o t e 1 ) t rc - - 2 s sck fall time ( n o t e 1 ) t fc - - 2 s output rise time ( n o t e 1 ) t ro - - 40 ns output fall time ( n o t e 1 ) t fo - - 40 ns write time t e/w - - 5 ms (note1) not 100% tested ac timing characteristics conditions parameter symbol limits unit conditions min typ max load capacitance c l - - 30 pf 2.5v ? vcc<4.0v - - 50 pf 4.0v ? vcc? 5.5v input voltage - 0.2vcc/0.8vcc v input / output judgment vo ltage - 0.3vcc/0.7vcc v sync data input / output timing figure 2-(a). input timing figure 2-(b). input / output timing csb sck si so tcs tcss tscks tsckwl tsckwh tdis tdih trc tfc high-z csb sck si so tpd toh tro,tfo toz tcsh tsckh tcs hi g h-z figure 2-(c). hold timing csb sck si n+1 "h" "l" n dn n-1 dn dn-1 holdb so dn+1 thfs thfh thoz thrs thrh tdis thpd high-z si is taken into ic inside in sync with data rise edge of sck. input address and data from the most significant bit msb so is output in sync with data fall edge of sck. data is output from the most significant bit msb.
datasheet 4/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com block diagram pin configuration pin descriptions terminal name input /output function vcc - power source to be connected gnd - all input / output reference voltage, 0v csb input chip select input sck input serial clock input si input start bit, ope code, address, and serial data input so output serial data output holdb input hold input command communications may be suspended temporarily (hold status) wpb input write protect input write command is prohibited write status register command is prohibited figure 3. block diagram figure 4. pin configuration instruction decode control clock generation voltage detection write inhibition high voltage generator instruction register 256k eeprom address register data register address decoder read/write amp 8bit status register 1 csb 2 so 3 wpb 4 gnd 8 vcc 7 holdb 6 sck 5 si 15bit 8bit 15bit (top view) vcc holdb sck si csb so wpb gnd
datasheet 5/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com figure 7 "l" output voltage(vcc=2.5v) vs supply voltage figure 8. "h" output voltage(vcc=2.5v) vs supply voltage figure 5. "h" input voltage vs supply voltage (csb,sck,si,holdb,wpb) figure 6. "l" input voltage vs supply voltage (csb,sck,si,holdb,wpb) typical performance curves (the following characteristic data are typ. values.) 2.2 2.3 2.4 2.5 2.6 0 0.2 0.4 0.6 0.8 1 1.2 i oh [m a] v oh [v] spec ta=-40c ta= 25c ta= 105c 0 1 2 3 4 5 6 0123456 vcc [v] v ih [v] ta= -40c ta= 25c ta= 105c spec 0 1 2 3 4 5 6 0123456 vcc [v] v il [v] spec ta=- 40c ta= 25c ta= 105c 0 0.2 0.4 0.6 0.8 1 0123456 i ol [m a] v ol [v] spec ta= -40c ta= 25c ta= 105c
datasheet 6/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com figure 10. output leak current vs supply voltage figure 12 current consumption at read operation vs supply voltage figure 9. input leak curr ent vs supply voltage (csb, sck, si, holdb, wpb) figure 11. current consumpt ion at write operation vs supply voltage typical performance curves \ continued 0 0.2 0.4 0.6 0.8 1 1.2 0123456 vcc [v] i li [ua] spec ta= -40c ta= 25c ta= 105c 0 0.2 0.4 0.6 0.8 1 1.2 0123456 vcc [v] i lo [ua] spec ta= -40c ta= 25c ta= 105c 0 1 2 3 4 0123456 vcc [v] i cc1 (ma) spec ta= -40c ta= 25c ta= 105c 0 2 4 6 8 10 0123456 vcc [v] i cc2 [ma] spec ta=- 40c ta= 25c ta= 105c
datasheet 7/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com figure 13. current consumpt ion at standby operation vs supply voltage figure 15. sck high time vs supply voltage figure 16. sck low time vs supply voltage figure 14. sck frequency vs supply voltage typical performance curves \ continued 0 2 4 6 8 10 12 0123456 vcc [v] i sb [ua] spec ta= -40c ta= 25c ta= 105c 0.1 1 10 100 1000 0123456 vcc [v] f sck [mhz] spec ta=-40c ta= 25c ta= 105c 0 20 40 60 80 100 120 140 0123456 vcc [v] t sckwh [ns] ta= - 40c ta= 25c ta= 105c spec 0 20 40 60 80 100 120 140 0123456 vcc [v] t sckw l [ns] ta=-40c ta= 25c ta= 105c spec
datasheet 8/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com figure 17. csb high time vs supply voltage figure 18. csb setup time vs supply voltage figure 19. csb hold time vs supply voltage figure 20. si setup time vs supply voltage typical performance curves \ continued 0 50 100 150 200 250 300 0123456 vcc [v] t cs [ns] ta=-40c ta= 25c ta= 105c spec 0 20 40 60 80 100 120 0123456 vcc [v] t css [ns] ta=-40c ta= 25c ta= 105c spec 0 20 40 60 80 100 120 0123456 vcc [v] t csh [ns] ta= - 40c ta= 25c ta= 105c spec 0 10 20 30 40 50 0123456 vcc [v] t dis [ns] spec ta= - 40c ta= 25c ta= 105c
datasheet 9/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com figure 21. si hold time vs supply voltage figure 22. data output delay time vs supply voltage figure 23. output disable time vs supply voltage figure 24. holdb setting hold time vs supply voltage typical performance curves \ continued 0 20 40 60 80 100 120 0123456 vcc [v] t hfh [ns] spec ta= - 40c ta= 25c ta= 105c 0 10 20 30 40 50 60 0123456 vcc [v] t dih [ns] ta=-40c ta= 25c ta= 105c spec 0 20 40 60 80 100 120 140 0123456 vcc [v] t pd [ns] spec ta= - 40c ta= 25c ta= 105c 0 30 60 90 120 150 180 210 0123456 vcc [v] t oz [ns] spec ta=- 40c ta= 25c ta= 105c
datasheet 10/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com figure 25. holdb release hold time vs supply voltage figure 26. time from holdb to output high-z vs supply voltage figure 27. time from holdb to output change vs supply voltage figure 28. output rise time vs supply voltage typical performance curves \ continued 0 20 40 60 80 100 120 0123456 vcc [v] thrh [ns] spec ta= - 40c ta= 25c ta= 105c 0 20 40 60 80 100 120 0123456 vcc [v] thoz [ns] spec ta= - 40c ta= 25c ta= 105c 0 20 40 60 80 100 120 0123456 vcc [v] t hpd [ns] spec ta=-40c ta= 25c ta= 105c 0 20 40 60 80 100 120 0123456 vcc [v] t ro [ns] spec ta= - 40c ta= 25c ta= 105c
datasheet 11/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com figure 29. output fall time vs supply voltage figure 30. w r ite cycle time vs supply voltage typical performance curves \ continued 0 20 40 60 80 100 120 0123456 vcc [v] t fo [ns] ta=-40c ta= 25c ta= 105c spec 0 1 2 3 4 5 0123456 vcc [v] t e/w [ms] ta=-40c ta= 25c ta= 105c spec
datasheet 12/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com features 1. status registers this ic has status register. the status register expresses the following parameters of 8 bits. bp0 and bp1 can be set by write status register command. t hese 2 bits are memorized in to the eeprom, therefore are valid even when power source is turned off. rewrite characteristics and data hold time ar e same as characteristics of the eeprom. wen can be set by write enable command and write disable command. wen becomes write disable status when power source is turned off. r/b is for write conf irmation, therefore cannot be set externally. the value of status register can be read by read status register command. (1) contexture of status register bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 wpen 0 0 0 bp1 bp0 wen r D /b bit memory location function wpen eeprom wpb pin enable / disable designation bit wpen=0=invalid wpen=1=valid bp1 bp0 eeprom eeprom write disabl e block designation bit wen registers write and write status register write enable / disable status confirmation bit wen=0=prohibited wen=1=permitted r D /b registers write cycle status (ready / busy) status confirmation bit r D /b=0=ready r D /b=1=busy (2) write disable block setting bp1 bp0 write disable block 0 0 none 0 1 6000h-7fffh 1 0 4000h-7fffh 1 1 0000h-7fffh 2. wpb pin by setting wpb=low, write command is prohibited. and the write command to be disabled at this moment is wrsr. however, when write cycle is in execution, no interruption can be made. wrsr write prohibition possible but wpen bit ?1? prohibition impossible 3. holdb pin by holdb pin, data transfer can be interrupted. when sck=?0 ?, by making holdb from ?1? into?0?, data transfer to eeprom is interrupted. when sck = ?0?, by making holdb from ?0? into ?1?, data transfer is restarted.
datasheet 13/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com command mode command contents ope code wren write enable command 0000 0110 wrdi write disable command 0000 0100 read read command 0000 0011 write write command 0000 0010 rdsr read status register command 0000 0101 wrsr write status register command 0000 0001 timing chart 1. write enable (wren) / disable (wrdi) command this ic has write enable status and write disable status. it is set to write enable status by write enable command, and it is set to write disable status by write disable command. as for these commands, set csb low, and then input the respective ope codes. the respective commands are accepted at the 7-th clock rise. even with input over 7 clocks, command becomes valid. when to carry out write command, it is necessary to set write enable status by the write enable command. if write command is input in the write disable st atus, the command is cancel led. and even in the writ e enable status, once write command is executed, it gets in the wr ite disable status. after power on, this ic is in write disable status. 2. read command (read) by read command, data of eeprom can be read. as for th is command, set csb low, then input address after read ope code. eeprom starts data output of the designated address. da ta output is started from sc k fall of 23-th clock, and from d7 to d0 sequentially. this ic has increment read functi on. after output of data for 1 byte (8bits), by continuing input of sck, data of the next address can be read. increment r ead can read all the addresses of eeprom. after reading data of the most significant address, by continuing increment read, data of t he most insignificant address is read. wren (write enable): write enable figure 31. write enable command high-z 6 03 7 12 45 csb sck so si 00000110 figure 32. write disable command wrdi (write disable): write disable high-z 0000 si 0100 03 12 4 7 csb sck 5 6 so high-z 11 1 1 0 0 3 7 1 2 d6 so csb sck si 4 5 a12 6 8 * a0a1 d7 23 30 24 d0 0 0 0 0 0 d2 d1 d> d> d> d> d> d> d> d> d> d> d> d> d> d> d> d> d> d> d> d> 9 10 a13 a14 30 31 figure 33. read command
datasheet 14/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com 3. write command (write) by write command, data of eeprom can be written. as fo r this command, set csb low, then input address and data after write ope code. then, by making csb high, the eeprom starts writing. the write time of eeprom requires time of t e/w (max 5ms). during t e/w , other than read status regist er command is not accepted. set csb high between taking the last data (d0) and rising the next sck clock. at the other timing, write command is not executed, and this write command is cancelled. this ic has page writ e function, and after input of data for 1 byte (8 bits), by continuing data input without setting csb high, 2byte or more data can be written for one t e/w . up to 64 arbitrary bytes can be written. in page write, the insignificant 6 bit of the designated address is incremented internal ly at every time when data of 1 byte is input and data is written to respective addresses. when data of t he maximum bytes or higher is input, address rolls over, and previously input data is overwritten. 4. write status register, read status register command (wrsr/rdsr) write status register command can write data of status register. the data can be wr itten by this command are 3 bits, that is, wpen (bit7), bp1 (bit3) and bp0 (bit2) among 8 bits of status register. by bp1 and bp0, write disable block of eeprom can be set. as for this command, set csb low, and in put ope code of write status register, and input data. then, by making csb high, eeprom starts writing. write time requires time of t e/w as same as write. as for csb rise, set csb high between taking the last data bit (bit0) and t he next sck clock rising. at the other timing, command is cancelled. write disable block is determined by bp1 bp0, and the block can be selected fr om 1/4, 1/2, and entire of memory array (refer to the write disable block setting table.). to the write disabled block, write cannot be made, and only read can be made. high-z =don't care 31 d0 0 0 0 0 0 d2 d1 d7 23 30 24 d6 0 a0a1 * 1 1 2 4 0 csb sck si so 0 3 7 8 5 6 a12 d> d> d> d> d> d> d> d> d> d> 11 d> d> d> d> d> d> d> d> 9 10 a13 a14 figure 34. write command csb sck high-z *=don't care 0 0 0 0 1 wpen 0 1 2 4 0 si so 0 3 7 8 5 6 * 9 10 11 12 13 14 15 * * bp1 bp0 * * bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 0 figure 35. write status register figure 36. read status register command high-z bit7 bit6 bit5 bit4 00 0 bit3 bit2 bit1 bit0 13 csb sck si 1 1 10 6 0 so 14 1 2 wen r/b 11 15 3 7 9 0 5 12 0 0 0 0 0 4 8 wpen bp1 bp0
datasheet 15/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com wpb cancel valid area wpb is normally fixed to ?h? or ?l? for use, but when wpb is controlled so as to cancel write status register command, pay attention to the follo wing wpb valid timing. while write status register command is executed, by setting w pb = ?l? in cancel valid area, command can be cancelled. the area from command ope code to csb rise at internal auto matic write start becomes the cancel valid area. however, once write is started, by any input write cycle cannot be cancelled. wpb input becomes don?t care, and cancellation becomes invalid. holdb pin by holdb pin, command communication can be stopped tempor arily (hold status). the command communications are carried out when the holdb pin is high. to get in hold status, at command communication, when sck=low, set the holdb pin low. at hold status, sck and si become don?t care, and so becomes high impedance (high-z). to release the hold status, set the holdb pin high when sck=low. after that, communication can be restarted from the point before the hold status. for example, when hold status is made after a5 address input at read, after release of hold status, by starting a4 address input, read can be restar ted. when in hold status, k eep csb low. when it is set csb=high in hold status, the ic is reset, theref ore communication after that cannot be restarted. figure 37. wpb valid timing (at inputting wrsr command) 6 7 ope code data te/w data write time sc k 15 16 in valid va li d in valid
datasheet 16/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com method to cancel each command 1. read, rdsr ? method to cancel : cancel by csb = ?h?. 2. write, page write a ope code or address input area cancellation is available by csb=?h?. b data input area (d7 to d1 input area) cancellation is available by csb=?h?. c data input area (d0 area) in this area, cancellation is not available. when csb is set high, write starts. d t e/w area in the area c, by rising csb, write starts. while writing, by any input, cancellation cannot be made. note1) if vcc is made off during write ex ecution, designated address data is not guaranteed, therefore write it once again. note2) if csb is rised at the same timing as that of the sck ri se, write execution / cancel becomes unstable, therefore, it is recommended to rise in sck = ?l? area. as for sck rise, assure timing of t css / t csh or more. 3. wrsr a from ope code to 15-th clock rise cancellation is available by csb=?h?. b from 15-th clock rise to 16-th clock rise (write enable area) in this area, cancellation is not available by csb=?h?. when csb is set high, write starts. c after 16-th clock rise. cancellation is available by csb=?h?. however, if write starts (csb is rised) in the area b, cancellation cannot be made by any means. and, by inputting on sck clock, cancellation cannot be made. note1) if vcc is made off during write ex ecution, designated address data is not guaranteed, therefore write it once again note2) if csb is rised at the same timing as that of the sck ri se, write execution / cancel becomes unstable, therefore, it is recommended to rise in sck = ?l? area. as for sck rise, assure timing of t css / t csh or more. 4. wren/wrdi a from ope code to 7-th clock rise, cancellation is available by csb = ?h?. b cancellation is not available 7-th clock. figure 38. read cancel valid timing figure 39. rdsr cancel valid timing figure 42. wren/wrdi cancel valid timing ope code address a data t e/w b d c 8bits 8bits 16bits d7 b d6 d5 d4 d3 d2 d1 d0 sck si c figure 41. wrsr cancel valid timing ope code address cancel available in all areas of read mode data 8 bits 8 bits 16 bits ope code cancel available in all areas of rdsr mode data 8 bits 8 bits ope code data t e/w 8 bits 14 15 16 17 d1 d0 a b c 8 bits a b c sck si ope code 8 bits 6 7 8 a b sck figure 40. write cancel valid timing
datasheet 17/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com i/o peripheral circuits in order to realize stable high speed operations, pay a ttention to the following input / output pin conditions. input pin pull up, pull down resistance when to attach pull up, pull down resistance to eeprom input pin, select an appropriate value for the microcontroller v ol , i ol with considering v il characteristics of this ic. ilm olm v v olm olm pu i vvcc r 1. pull up resistance and, in order to prevent malfunction or erroneous write at power on/off, be sure to make csb pull up. 2. pull down resistance further, by amplitude v ihe , v ile of signal input to eeprom, operation s peed changes. by inputting vcc/gnd level amplitude of signal, more stable high speed operations can be realized. on the cont rary, when amplitude of 0.8v cc / 0.2vcc is input, operation speed becomes slow. *1 in order to realize more stable high speed operati on, it is recommended to make the values of r pu , r pd as large as possible, and make the amplitude of signal input to eeprom close to the amplitude of v cc / gnd level. ( * 1 in this case, guaranteed value of operating timing is guaranteed.) 3. so load capacity condition load capacity of so output pin affects upon delay characterist ic of so output (data output delay time, time from holdb to high-z, output rise time, output fall time.). in order to make output delay char acteristic into better, make so load capacity small. 4. other cautions make the each wire length from the microcontroller to eepro m input pin same length, in order to prevent setup / hold violation to eeprom, owing to difference of wire length of each input. eeprom so c l figure 45. so load capacity figure 43. pull up resistance figure 44. pull down resistance ??? ??? example) when v cc =5v, v ohm =v cc -0.5v, i ohm 0.4ma, v ihe =v cc 0.7v, from the equation ??? ??? with the value of rpu to satisfy the above equation, v olm becomes 0.4v or lower, and with v ile (=1.5v), the equation is also satisfied. ?v ile :eeprom v il specifications ?v olm :microcontroller v ol specifications ?i olm :microcontroller i ol specifications example) when vcc=5v, v ile =1.5v, v olm =0.4v, i olm =2ma, from the equation , i olm v ile v olm ?l? output ?l? input microcontroller eeprom r pu i ohm v ihe v ohm microcontroller eeprom ?h? output ?h? input r pd ][3.2 102 4.05 3 ? kr r pu pu \ \ ihm olm v v i v r ohm ohm pd ][3.11 104.0 5.05 3 ? kr r pd pd \ \
datasheet 18/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com equivalent circuit 1. output circuit 2. input circuit figure 50. holdb input equivalent circuit figure 51. wpb input equivalent circuit figure 46. so output equivalent circuit figure 47. csb input equivalent circuit figure 48. sck input equivalent circuit figure 49. si input equivalent circuit so internal signal internal signal csb internal signal internal signal sck internal signal holdb internal signal si internal signal wpb internal signal
datasheet 19/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com notes on power on/off 1. at standby set csb ?h?, and be sure to set sck, si input ?l? or ?h?. do not input intermediate electric potantial. 2. at power on/off when vcc rise or fall, set csb=?h? (=vcc). when csb is ?l?, this ic gets in input ac cept status (active). if power is turned on in this status, noises and the likes may cause malfunction, erroneous write or so . to prevent these, at power on, set c sb ?h?. (when csb is in ?h? status, all inputs are canceled.) (good example) csb terminal is pulled up to vcc. at power off, take 10ms or more before supply. if power is turned on without observing this condition, the ic internal circuit may not be reset. (bad example) csb terminal is ?l? at power on/off. in this case, csb always becomes ?l? (active status), and eeprom may have malfunction or erroneous write owing to noises and the likes. even when csb input is high-z, the status becomes like this case. 3. operating timing after power on as shown in figure 53, at standby, when sck is ?h?, even if c sb is fallen, si status is not read at fall edge. si status is read at sck rise edge after fall of csb. at standby and at power on/off, set csb ?h? status. 4. at power on malfunction preventing function this ic has a por (power on reset) circuit as mistake writ e countermeasure. after por acti on, it gets in write disable status. the por circuit is valid only when power is on, and does not work when power is off. when power is on, if the recommended conditions of the following t r , t off , and v bot are not satisfied, it may becom e write enable status owing to noises and the likes. recommended conditions of t r , t off , v bot t r t off v bot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below 5. low voltage malfunction preventing function lvcc (vcc-lockout) circuit prevents data rewrite ac tion at low power, and prevents wrong write. at lvcc voltage (typ. =1.2v) or below, it prevent data rewrite. t r t off vbot 0 vcc figure 52. csb timing at power on/off csb vcc bad example good example figure 54. rise waveform figure 53. operating timing 0 1 2 command start here. si is read. even if csb is fallen at sck=?h?, si status is not read at that edge. csb sck si
datasheet 20/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com noise countermeasures 1. vcc noise (bypass capacitor) when noise or surge gets in the power source line, malfunc tion may occur, therefore, for removing these, it is recommended to attach a bypass capacitor (0.1f) between ic vcc and gnd. at that time, atta ch it as close to ic as possible. and, it is also recommended to attach a bypass capacitor between board vcc and gnd. 2. sck noise when the rise time of sck (t rc ) is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit displacement. to avoid this, a schmitt trigger circuit is built in sck input. the hysteresis width of this circuit is set about 0.2v, if noises exist at sck input, set the noise amplit ude 0.2vp-p or below. and it is recommended to set the rise time of sck (t rc ) 100ns or below. in the case when the rise time is 100ns or higher, take sufficient noise countermeasures. make the clock rise, fall time as small as possible. 3. wpb noise during execution of write status regist er command, if there exist noises on w pb pin, mistake in recognition may occur and forcible cancellation may result. to avoid this, a schmitt trigger circuit is built in wpb input. in the same manner, a schmitt trigger circuit is built in c sb input, si input and holdb input too.
datasheet 21/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet 22/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com operational notes ? continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused in put pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevit ably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which c ause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. fu rthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic.
datasheet 23/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com ordering information b r 2 5 a 2 5 6 x x x - 3 m g e 2 lineup capacity package orderable part number remark type quantity 256k sop8 reel of 2500 br25a256f -3mge2 halogen free sop-j8 br25a256fj -3mge2 halogen free tssop-b8 reel of 3000 br25a256fvt -3mge2 halogen free bus type 25 spi operating temperature / voltage -40c to +105c / 2.5v to 5.5v process code packaging and formi ng specification e2 : embossed tape and reel 256=256k capacity m : f or automotive package f fj fvt : sop8 : sop-j8 : tssop-b8 g : halogen free
datasheet 24/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com physical dimension tape and reel information package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)
datasheet 25/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com physical dimension tape and reel information - continued package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet 26/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com physical dimension tape and reel information - continued package name tssop-b8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin
datasheet 27/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com marking diagrams tssop-b8 (top view) part number marking 5 a 2 5 lot numbe r 1pin mark sop-j8 (top view) 5 a 2 5 part number marking lot number 1pin mark sop8 (top view) part number marking 5 a 2 5 lot numbe r 1pin mark
datasheet 28/28 br25a256-3m tsz02201-0r1r0g100390-1-2 21.apr.2014 rev.002 ?2014 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com revision history date revision changes 18.feb.2014 001 new release 21.apr.2014 002 p3 change load capacitance value to c l =50pf (4.0v vcc 5.5v) add min value of sck frequency delete input rise time and input fall time of ac timing characteristics conditions
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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